Glass, glass-ceramic and ceramic articles with protective coatings having hardness and toughness

ABSTRACT

An article is described herein which includes: a transparent substrate having a primary surface; and a protective film disposed on the primary surface, such that each of the substrate and the protective film have an optical transmittance of 20% or more in the visible spectrum, and such that the protective film includes at least one of: (1) a hardness of greater than 13 GPa, as measured by a Berkovich nanoindenter, or (2) an effective fracture toughness (Kc) of greater than 2.5 MPa·m 1/2 , as measured by indentation fracture at a depth of greater than 1 μm.

CLAIM OF PRIORITY

This application is a continuation application of U.S. patentapplication Ser. No. 16/690,499, filed Nov. 21, 2019, now pending, whichclaims the benefit of priority under 35 U.S.C. § 119 of U.S. ProvisionalApplication Ser. No. 62/770,444 filed on Nov. 21, 2018. The contents ofthese documents are hereby incorporated by reference herein for allpurposes.

FIELD

The present disclosure generally relates to glass, glass-ceramic andceramic articles with protective films and coatings having a highhardness and toughness, particularly, transparent protective coatingsand films with a combination of hardness and toughness.

BACKGROUND

Glass, glass-ceramic and ceramic materials, many of which are configuredor otherwise processed with various strength-enhancing features, areprevalent in various displays and display devices of many consumerelectronic products. For example, chemically strengthened glass isfavored for many touch-screen products, including cell phones, musicplayers, e-book readers, notepads, tablets, laptop computers, automaticteller machines, and other similar devices. Many of these glass,glass-ceramic and ceramic materials are also employed in displays anddisplay devices of consumer electronic products that do not havetouch-screen capability, but are prone to mechanical contact, includingdesktop computers, laptop computers, elevator screens, equipmentdisplays, and others.

Glass, glass-ceramic and ceramic materials, as processed in some caseswith strength-enhancing features, are also prevalent in variousapplications desiring display- and/or optic-related functionality anddemanding mechanical property considerations. For example, thesematerials can be employed as cover lenses, substrates and housings forwatches, smartphones, retail scanners, eyeglasses, eyeglass-baseddisplays, outdoor displays, automotive displays and other relatedapplications. These materials can also be employed in vehicularwindshields, vehicular windows, vehicular moon-roof, sun-roof andpanoramic roof elements, architectural glass, residential and commercialwindows, and other similar applications.

As used in these display and related applications, these glass,glass-ceramic and ceramic materials are often coated with transparentand semi-transparent, scratch-resistant films to increase wearresistance and resist the development of mechanically-induced defectsthat can otherwise lead to premature failure. These conventionalscratch-resistant coatings and films, however, are often prone to lowstrain-to-failure. As a result, the articles employing these films canbe characterized by good wear resistance, but also by lack of benefit interms of flexural strength, drop resistance and/or toughness.Furthermore, the relatively low strain-to-failure of the conventionalscratch-resistant films and coatings can contribute to higher scratchvisibility through “frictive cracking” and “chatter cracking”mechanisms, generally associated with the brittleness of these films andcoatings.

In view of these considerations, there is a need for glass,glass-ceramic and ceramic articles with protective films and coatingshaving a high hardness and toughness, particularly, transparentprotective coatings and films with a combination of high hardness andtoughness.

SUMMARY

In some embodiments, an article comprises: a transparent substratecomprising a primary surface; and a protective film disposed on theprimary surface, wherein the protective film comprises at least one of:(1) a hardness of greater than 13 GPa, as measured by a Berkovichnanoindenter, (2) an effective fracture toughness (Kc) of greater than2.5 MPa·m^(1/2), or (3) an optical extinction coefficient (k) equal toor less than 1×10², measured at 400 nm wavelength.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a strain-to-failure ofgreater than 0.7%, as measured by a ring-on-ring test.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a thickness in a range of 1.0μm to 50 μm.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises both (1) and (2).

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a compressive film stressgreater than 50 MPa.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises an optical transmittance of50% or more in the visible spectrum.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a refractive index (n) of atleast 2.0, measured at 550 nm wavelength.

In one aspect, which is combinable with any of the other aspects orembodiments, each of the substrate and the protective film comprises anoptical transmittance of 20% or more in the visible spectrum.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a coating failure stress ofgreater than 800 MPa.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a composition having greaterthan 80% ZrO₂, by molar concentration or volume.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises tetragonal ZrO₂, monoclinicZrO₂, or a combination thereof.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises an inorganic material,wherein the material is polycrystalline or semi-polycrystalline andcomprises an average crystallite size of less than 1 micron.

In one aspect, which is combinable with any of the other aspects orembodiments, the substrate further comprises a compressive stressregion, the compressive stress region extending from the primary surfaceto a first selected depth in the substrate.

In one aspect, which is combinable with any of the other aspects orembodiments, the protective film comprises a multilayer optical coatingselected from at least one of: anti-reflective film, dielectric mirrorfilm, infrared blocking film, ultraviolet blocking film,wavelength-selective bandpass film, or notch filter.

In one aspect, which is combinable with any of the other aspects orembodiments, the multilayer optical coating comprises at least oneZrO₂-based film having a refractive index of n1, and at least one lowerrefractive index material film having a refractive index of n2, whereinn1 is greater than n2.

In some embodiments, a consumer electronic product comprises: a housingcomprising front, back and side surfaces; electrical components that areat least partially inside the housing; and a display at or adjacent tothe front surface of the housing, wherein the article of claim 1 is atleast one of disposed over the display and disposed as a portion of thehousing.

In some embodiments, a vehicle display system comprises: a housingcomprising front, back and side surfaces; electrical components that areat least partially inside the housing; and a display at or adjacent tothe front surface of the housing, wherein the article of claim 1 is atleast one of disposed over the display and disposed as a portion of thehousing.

In some embodiments, a device comprises an article as described herein.In one aspect, which is combinable with any of the other aspects orembodiments, the device comprises a camera lens cover, an optical sensorcover, or an infrared (IR) sensor cover.

Additional features and advantages will be set forth in the detaileddescription which follows, and will be readily apparent to those skilledin the art from that description or recognized by practicing theembodiments as described herein, including the detailed descriptionwhich follows, the claims, as well as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description are merely exemplary, and areintended to provide an overview or framework to understanding the natureand character of the disclosure and the appended claims.

The accompanying drawings are included to provide a furtherunderstanding of principles of the disclosure, and are incorporated in,and constitute a part of, this specification. The drawings illustrateone or more embodiment(s) and, together with the description, serve toexplain, by way of example, principles and operation of the disclosure.It is to be understood that various features of the disclosure disclosedin this specification and in the drawings can be used in any and allcombinations. By way of non-limiting examples, the various features ofthe disclosure may be combined with one another according to thefollowing embodiments.

According to a first aspect, an article is provided that includes: asubstrate comprising a glass, glass-ceramic or a ceramic composition anda primary surface; and a protective film disposed on the primarysurface. Each of the substrate and the film comprises an opticaltransmittance of 20% or more in the visible spectrum. Further, theprotective film comprises a hardness of greater than 10 GPa, as measuredby a Berkovich nanoindenter, and a strain-to-failure of greater than0.8%, as measured by a ring-on-ring test.

According to a second aspect, the article of aspect 1 is provided,wherein the protective film comprises a thickness in the range fromabout 0.2 microns to about 10 microns.

According to a third aspect, the article of aspect 2 is provided,wherein the protective film comprises an inorganic material, wherein thematerial is polycrystalline or semi-polycrystalline and comprises anaverage crystallite size of less than 1 micron.

According to a fourth aspect, the article of aspect 3 is provided,wherein the inorganic material is selected from the group consisting ofaluminum nitride, aluminum oxynitride, alumina, spinel, mullite,zirconia-toughened alumina, zirconia, stabilized zirconia, andpartially-stabilized zirconia.

According to a fifth aspect, the article of aspect 3 is provided,wherein the inorganic material comprises a substantially isotropic,non-columnar microstructure, and further wherein a ratio of thethickness of the protective film to the average crystallite size of thematerial is 4× or greater.

According to a sixth aspect, the article of aspect 2 is provided,wherein the protective film comprises a yttria-stabilized tetragonalzirconia polycrystalline (Y-TZP) material.

According to a seventh aspect, the article of aspect 6 is provided,wherein the Y-TZP material comprises about 1 to 8 mol % yttria andgreater than 1 mol % of tetragonal zirconia.

According to an eighth aspect, the article of aspect 1 or aspect 2 isprovided, wherein the protective film comprises an energy-absorbingmaterial comprising a plurality of microstructure defects, theenergy-absorbing material selected from the group consisting of yttriumdisilicate, boron suboxide, titanium silicon carbide, quartz, feldspar,amphibole, kyanite and pyroxene.

According to a ninth aspect, the article of any one of aspects 1-8 isprovided, wherein the protective film comprises an optical transmittanceof 50% or more in the visible spectrum, and further wherein the filmcomprises a hardness of greater than 14 GPa at an indentation depth of100 nm or 500 nm, as measured by a Berkovich nanoindenter, and astrain-to-failure of greater than 1%, as measured by a ring-on-ringtest.

According to a tenth aspect, the article of any one of aspects 1-9 isprovided, wherein the protective film further comprises a compressivefilm stress of greater than 50 MPa.

According to an eleventh aspect, the article of any one of aspects 1-10is provided, wherein the protective film comprises a hardness of greaterthan 16 GPa at an indentation depth of 100 nm to 500 nm, as measured bya Berkovich nanoindenter, and a strain-to-failure of greater than 1.6%,as measured by a ring-on-ring test.

According to a twelfth aspect, the article of any one of aspects 1-12 isprovided, wherein the protective film further comprises a fracturetoughness of greater than 1 MPa·m^(1/2).

According to a thirteenth aspect, an article is provided that includes:a glass substrate comprising a primary surface and a compressive stressregion, the compressive stress region extending from the primary surfaceto a first selected depth in the substrate; and a protective filmdisposed on the primary surface. Each of the substrate and the filmcomprises an optical transmittance of 20% or more in the visiblespectrum. Further, the protective film comprises a hardness of greaterthan 10 GPa, as measured by a Berkovich nanoindenter, and astrain-to-failure of greater than 0.8%, as measured by a ring-on-ringtest.

According to a fourteenth aspect, the article of aspect 13 is provided,wherein the protective film comprises a thickness in the range fromabout 0.2 microns to about 10 microns.

According to a fifteenth aspect, the article of aspect 14 is provided,wherein the protective film comprises an inorganic material, wherein thematerial is polycrystalline or semi-polycrystalline and comprises anaverage crystallite size of less than 1 micron.

According to a sixteenth aspect, the article of aspect 15 is provided,wherein the inorganic material is selected from the group consisting ofaluminum nitride, aluminum oxynitride, alumina, spinel, mullite,zirconia-toughened alumina, zirconia, stabilized zirconia, andpartially-stabilized zirconia.

According to a seventeenth aspect, the article of aspect 15 is provided,wherein the inorganic material comprises a substantially isotropic,non-columnar microstructure, and further wherein a ratio of thethickness of the protective film to the average crystallite size of thematerial is 4× or greater.

According to an eighteenth aspect, the article of aspect 14 is provided,wherein the protective film comprises a yttria-stabilized tetragonalzirconia polycrystalline (Y-TZP) material.

According to a nineteenth aspect, the article of aspect 18 is provided,wherein the Y-TZP material comprises about 1 to 8 mol % yttria andgreater than 1 mol % of tetragonal zirconia.

According to a twentieth aspect, the article of aspect 13 or aspect 14is provided, wherein the protective film comprises an energy-absorbingmaterial comprising a plurality of microstructure defects, theenergy-absorbing material selected from the group consisting of yttriumdisilicate, boron suboxide, titanium silicon carbide, quartz, feldspar,amphibole, kyanite and pyroxene.

According to a twenty-first aspect, the article of any one of aspects13-20 is provided, wherein the protective film comprises an opticaltransmittance of 50% or more in the visible spectrum, and furtherwherein the film comprises a hardness of greater than 14 GPa at anindentation depth of 100 nm to 500 nm, as measured by a Berkovichnanoindenter, and a strain-to-failure of greater than 1%, as measured bya ring-on-ring test.

According to a twenty-second aspect, the article of any one of aspects13-21 is provided, wherein the protective film further comprises acompressive film stress of greater than 50 MPa.

According to a twenty-third aspect, the article of any one of aspects13-22 is provided, wherein the protective film comprises a hardness ofgreater than 16 GPa at an indentation depth of 100 nm to 500 nm, asmeasured by a Berkovich nanoindenter, and a strain-to-failure of greaterthan 1.6%, as measured by a ring-on-ring test.

According to a twenty-fourth aspect, the article of any one of aspects13-23 is provided, wherein the protective film further comprises afracture toughness of greater than 1 MPa·m^(1/2).

According to a twenty-fifth aspect, a consumer electronic product isprovided that includes: a housing that includes a front surface, a backsurface and side surfaces; electrical components that are at leastpartially inside the housing; and a display at or adjacent to the frontsurface of the housing. Further, the article of any one of aspects 1-24is at least one of disposed over the display and disposed as a portionof the housing.

According to a twenty-sixth aspect, a vehicle display system is providedthat includes: a housing that includes a front surface, a back surfaceand side surfaces; electrical components that are at least partiallyinside the housing; and a display at or adjacent to the front surface ofthe housing. Further, the article of any one of aspects 1-24 is at leastone of disposed over the display and disposed as a portion of thehousing.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentdisclosure are better understood when the following detailed descriptionof the disclosure is read with reference to the accompanying drawings,in which:

FIG. 1 is a cross-sectional, schematic view of an article comprising aglass, glass-ceramic or ceramic substrate with a protective filmdisposed over the substrate, according to some embodiments of thedisclosure.

FIG. 2A is a plan view of an exemplary electronic device incorporatingany of the articles disclosed herein.

FIG. 2B is a perspective view of the exemplary electronic device of FIG.2A.

FIG. 3 is a perspective view of a vehicle interior with vehicularinterior systems that may incorporate any of the articles disclosedherein.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation andnot limitation, example embodiments disclosing specific details are setforth to provide a thorough understanding of various principles of thepresent disclosure. However, it will be apparent to one having ordinaryskill in the art, having had the benefit of the present disclosure, thatthe present disclosure may be practiced in other embodiments that departfrom the specific details disclosed herein. Moreover, descriptions ofwell-known devices, methods and materials may be omitted so as not toobscure the description of various principles of the present disclosure.Finally, wherever applicable, like reference numerals refer to likeelements.

Ranges can be expressed herein as from “about” one particular value,and/or to “about” another particular value. As used herein, the term“about” means that amounts, sizes, formulations, parameters, and otherquantities and characteristics are not and need not be exact, but may beapproximate and/or larger or smaller, as desired, reflecting tolerances,conversion factors, rounding off, measurement error and the like, andother factors known to those of skill in the art. When the term “about”is used in describing a value or an end-point of a range, the disclosureshould be understood to include the specific value or end-point referredto. Whether or not a numerical value or end-point of a range in thespecification recites “about,” the numerical value or end-point of arange is intended to include two embodiments: one modified by “about,”and one not modified by “about.” It will be further understood that theendpoints of each of the ranges are significant both in relation to theother endpoint, and independently of the other endpoint.

The terms “substantial,” “substantially,” and variations thereof as usedherein are intended to note that a described feature is equal orapproximately equal to a value or description. For example, a“substantially planar” surface is intended to denote a surface that isplanar or approximately planar. Moreover, “substantially” is intended todenote that two values are equal or approximately equal. In someembodiments, “substantially” may denote values within about 10% of eachother, such as within about 5% of each other, or within about 2% of eachother.

Directional terms as used herein—for example up, down, right, left,front, back, top, bottom—are made only with reference to the figures asdrawn and are not intended to imply absolute orientation.

Unless otherwise expressly stated, it is in no way intended that anymethod set forth herein be construed as requiring that its steps beperformed in a specific order. Accordingly, where a method claim doesnot actually recite an order to be followed by its steps, or it is nototherwise specifically stated in the claims or descriptions that thesteps are to be limited to a specific order, it is in no way intendedthat an order be inferred, in any respect. This holds for any possiblenon-express basis for interpretation, including: matters of logic withrespect to arrangement of steps or operational flow; plain meaningderived from grammatical organization or punctuation; the number or typeof embodiments described in the specification.

As used herein, the singular forms “a,” “an” and “the” include pluralreferents unless the context clearly dictates otherwise. Thus, forexample, reference to a “component” includes embodiments having two ormore such components, unless the context clearly indicates otherwise.

Embodiments of the disclosure generally pertain to articles havingglass, glass-ceramic and ceramic substrates with protective films,preferably transparent protective films having a combination of highhardness and toughness. For example, the protective films can bedisposed on one or more primary surfaces of these substrates and aregenerally characterized by substantial transparency, e.g., an opticaltransmittance of 20% or more in the visible spectrum. These protectivefilms can also be characterized by a high hardness, e.g., greater than10 GPa, and a high toughness, e.g., a strain-to-failure of greater than0.8%. The disclosure is also directed to articles having a glasssubstrate with a compressive stress region, and a protective filmdisposed on one or more of primary surfaces of the substrate.

Referring to FIG. 1, an article 100 is depicted that includes asubstrate 10 comprising a glass, glass-ceramic or ceramic composition.That is, the substrate 10 may include one or more of glass,glass-ceramic, or ceramic materials therein. The substrate 10 comprisesa pair of opposing primary surfaces 12, 14. Further, the article 100includes a protective film 90 with an outer surface 92 b disposed overthe primary surface 12. As also shown in FIG. 1, the protective film 90has a thickness 94. In embodiments, the article 100 can include one ormore protective films 90 disposed over one or more primary surfaces 12,14 of the substrate 10. As shown in FIG. 1, one or more of the films 90are disposed over the primary surface 12 of the substrate 10. Accordingto some implementations, the protective film or films 90 can also bedisposed over the primary surface 14 of the substrate 10.

According to some implementations, the article 100 depicted in FIG. 1includes a substrate 10 that comprises a glass, glass-ceramic or aceramic composition and a primary surface 12, 14; and a protective film90 disposed on the primary surface 12, 14. Each of the substrate 10 andthe film 90 comprises an optical transmittance of 20% or more in thevisible spectrum. Further, the protective film 90 comprises a hardnessof greater than 10 GPa, as measured by a Berkovich nanoindenter, and astrain-to-failure of greater than 0.8%, as measured by a ring-on-ringtest.

According to other implementations, the article 100 depicted in FIG. 1includes a substrate 10 having a glass composition, comprising a primarysurface 12, 14 and a compressive stress region 50. As shown, thecompressive stress region 50 extends from the primary surface 12 to afirst selected depth 52 in the substrate; nevertheless, some embodimentsinclude a comparable compressive stress region 50 that extends from theprimary surface 14 to a second selected depth (not shown). The article100 also includes a protective film 90 disposed on the primary surface12. Each of the substrate 10 and the film 90 comprises an opticaltransmittance of 20% or more in the visible spectrum. Further, theprotective film 90 comprises a hardness of greater than 10 GPa, asmeasured by a Berkovich nanoindenter, and a strain-to-failure of greaterthan 0.8%, as measured by a ring-on-ring test.

In some embodiments of the article 100, as depicted in FIG. 1, thesubstrate 10 comprises a glass composition. The substrate 10, forexample, can comprise a borosilicate glass, an aluminosilicate glass,soda-lime glass, chemically strengthened borosilicate glass, chemicallystrengthened aluminosilicate glass, and chemically strengthenedsoda-lime glass. In some embodiments, the glass may be alkali-free. Thesubstrate may have a selected length and width, or diameter, to defineits surface area. The substrate may have at least one edge between theprimary surfaces 12, 14 of the substrate 10 defined by its length andwidth, or diameter. The substrate 10 may also have a selected thickness.In some embodiments, the substrate has a thickness of from about 0.2 mmto about 1.5 mm, from about 0.2 mm to about 1.3 mm, and from about 0.2mm to about 1.0 mm. In other embodiments, the substrate has a thicknessof from about 0.1 mm to about 1.5 mm, from about 0.1 mm to about 1.3 mm,or from about 0.1 mm to about 1.0 mm.

According to some embodiments of the article 100, the substrate 10comprises a compressive stress region 50 (see FIG. 1) that extends fromat least one of the primary surfaces 12, 14 to a selected depth 52. Asused herein, a “selected depth,” (e.g., selected depth 52) “depth ofcompression” and “DOC” are used interchangeably to define the depth atwhich the stress in the chemically strengthened alkali aluminosilicateglass article described herein changes from compressive to tensile. DOCmay be measured by a surface stress meter, such as an FSM-6000, or ascattered light polariscope (SCALP) depending on the ion exchangetreatment. Where the stress in the glass article is generated byexchanging potassium ions into the glass article, a surface stress meteris used to measure DOC. Where the stress is generated by exchangingsodium ions into the glass article, SCALP is used to measure DOC. Wherethe stress in the glass article is generated by exchanging bothpotassium and sodium ions into the glass, the DOC is measured by SCALP,since it is believed the exchange depth of sodium indicates the DOC andthe exchange depth of potassium ions indicates a change in the magnitudeof the compressive stress (but not the change in stress from compressiveto tensile); the exchange depth of potassium ions in such glass articlesis measured by a surface stress meter. As also used herein, the “maximumcompressive stress” is defined as the maximum compressive stress withinthe compressive stress region 50 in the substrate 10. In someembodiments, the maximum compressive stress is obtained at or in closeproximity to the one or more primary surfaces 12, 14 defining thecompressive stress region 50. In other embodiments, the maximumcompressive stress is obtained between the one or more primary surfaces12, 14 and the selected depth 52 of the compressive stress region 50.

In some implementations of the article 100, as depicted in exemplaryform in FIG. 1, the substrate 10 is selected from a chemicallystrengthened aluminosilicate glass. In other embodiments, the substrate10 is selected from chemically strengthened aluminosilicate glass havinga compressive stress region 50 extending to a first selected depth 52 ofgreater than 10 μm, with a maximum compressive stress of greater than150 MPa. In further embodiments, the substrate 10 is selected from achemically strengthened aluminosilicate glass having a compressivestress region 50 extending to a first selected depth 52 of greater than25 μm, with a maximum compressive stress of greater than 400 MPa. Thesubstrate 10 of the article 100 may also include one or more compressivestress regions 50 that extend from one or more of the primary surfaces12, 14 to a selected depth 52 (or depths) having a maximum compressivestress of greater than about 150 MPa, greater than 200 MPa, greater than250 MPa, greater than 300 MPa, greater than 350 MPa, greater than 400MPa, greater than 450 MPa, greater than 500 MPa, greater than 550 MPa,greater than 600 MPa, greater than 650 MPa, greater than 700 MPa,greater than 750 MPa, greater than 800 MPa, greater than 850 MPa,greater than 900 MPa, greater than 950 MPa, greater than 1000 MPa, andall maximum compressive stress levels between these values. In someembodiments, the maximum compressive stress is 2000 MPa or lower. Inaddition, the depth of compression (DOC) or first selected depth 52 canbe set at 10 μm or greater, 15 μm or greater, 20 μm or greater, 25 μm orgreater, 30 μm or greater, 35 μm or greater, and to even higher depths,depending on the thickness of the substrate 10 and the processingconditions associated with generating the compressive stress region 50.In some embodiments, the DOC is less than or equal to 0.3 time thethickness (t) of the substrate 50, for example 0.3 t, 0.28 t, 0.26 t,0.25 t, 0.24 t, 0.23 t, 0.22 t, 0.21 t, 0.20 t, 0.19 t, 0.18 t, 0.15 t,or 0.1 t. Compressive stress, including surface compressive stress (CS)levels, is measured by a surface stress meter using commerciallyavailable instruments such as the FSM-6000 (i.e., an FSM), asmanufactured by Orihara Industrial Co., Ltd. (Japan). Surface stressmeasurements rely upon the accurate measurement of the stress opticalcoefficient (SOC), which is related to the birefringence of the glass.SOC in turn is measured according to Procedure C (Glass Disc Method)described in ASTM standard C770-16, entitled “Standard Test Method forMeasurement of Glass Stress-Optical Coefficient,” the contents of whichare incorporated herein by reference in their entirety.

Similarly, with respect to glass-ceramics, the material chosen for thesubstrate 10 of the article 100 can be any of a wide range of materialshaving both a glassy phase and a ceramic phase. Illustrativeglass-ceramics include those materials where the glass phase is formedfrom a silicate, borosilicate, aluminosilicate, or boroaluminosilicate,and the ceramic phase is formed from β-spodumene, β-quartz, nepheline,kalsilite, or carnegieite. “Glass-ceramics” include materials producedthrough controlled crystallization of glass. In embodiments,glass-ceramics have about 30% to about 90% crystallinity. Examples ofsuitable glass-ceramics may include Li₂O—Al₂O₃—SiO₂ system (i.e.LAS-System) glass-ceramics, MgO—Al₂O₃—SiO₂ system (i.e. MAS-System)glass-ceramics, ZnO×Al₂O₃×nSiO₂ (i.e. ZAS system), and/or glass-ceramicsthat include a predominant crystal phase including β-quartz solidsolution, β-spodumene, cordierite, and lithium disilicate. Theglass-ceramic substrates may be strengthened using the chemicalstrengthening processes disclosed herein. In one or more embodiments,MAS-System glass-ceramic substrates may be strengthened in Li₂SO₄ moltensalt, whereby an exchange of 2Li⁺ for Mg²⁺ can occur.

With respect to ceramics, the material chosen for the substrate 10 ofthe article 100 can be any of a wide range of inorganic crystallineoxides, nitrides, carbides, oxynitrides, carbonitrides, and/or the like.Illustrative ceramics include those materials having an alumina,aluminum titanate, mullite, cordierite, zircon, spinel, persovskite,zirconia, ceria, silicon carbide, silicon nitride, silicon aluminumoxynitride or zeolite phase.

In some implementations of the article 100 depicted in FIG. 1, theprotective film 90 comprises an inorganic material, preferably aninorganic material that is polycrystalline or semi-polycrystalline.Typically, these polycrystalline and semi-polycrystalline materials havea higher fracture toughness than purely amorphous materials (e.g., glassfilms) due to the ability of the grain boundaries to defect cracks andincrease the energy for crack growth in the direction of principalstress. In some embodiments, the average crystallite size of theprotective film 90 can be less than 1 micron, less than 0.9 microns,less than 0.8 microns, less than 0.7 microns, less than 0.6 microns,less than 0.5 microns, less than 0.4 microns, less than 0.3 microns,less than 0.2 microns, and all average crystallite upper limits withinthese values. In certain implementations, the protective film 90 caninclude aluminum nitride, aluminum oxynitride, alumina, spinel, mullite,zirconia-toughened alumina, zirconia, stabilized zirconia, andpartially-stabilized zirconia. For those embodiments comprising nitridesand oxynitrides, the protective film 90 can include AlN, AlO_(x)N_(y),SiO_(x)N_(y), and Si_(u)Al_(x)O_(y)N_(z).

As understood by those with ordinary skill in the field of thedisclosure with regard to any of the foregoing materials (e.g., AlN) forthe protective film 90, each of the subscripts, “u,” “x,” “y,” and “z,”can vary from 0 to 1, the sum of the subscripts will be less than orequal to 1, and the balance of the composition is the first element inthe material (e.g., Si or Al). In addition, those with ordinary skill inthe field can recognize that “Si_(u)Al_(x)O_(y)N_(z)” can be configuredsuch that “u” equals zero and the material can be described as“AlO_(x)N_(y)”. Still further, the foregoing compositions for theprotective film 90 exclude a combination of subscripts that would resultin a pure elemental form (e.g., pure silicon, pure aluminum metal,oxygen gas, etc.). Finally, those with ordinary skill in the art willalso recognize that the foregoing compositions may include otherelements not expressly denoted (e.g., hydrogen), which can result innon-stoichiometric compositions (e.g., SiN_(x) vs. Si₃N₄). Accordingly,the foregoing materials for the optical film can be indicative of theavailable space within a SiO₂—Al₂O₃—SiN_(x)—AlN or aSiO₂—Al₂O₃—Si₃N₄—AlN phase diagram, depending on the values of thesubscripts in the foregoing composition representations.

As used herein, the “AlO_(x)N_(y),” “SiO_(x)N_(y),” and“Si_(u)Al_(x)O_(y)N_(z)” materials in the disclosure include variousaluminum oxynitride, silicon oxynitride and silicon aluminum oxynitridematerials, as understood by those with ordinary skill in the field ofthe disclosure, described according to certain numerical values andranges for the subscripts, “u,” “x,” “y,” and “z”. That is, it is commonto describe solids with “whole number formula” descriptions, such asAl₂O₃. It is also common to describe solids using an equivalent “atomicfraction formula” description such as Al_(0.4)O_(0.6), which isequivalent to Al₂O₃. In the atomic fraction formula, the sum of allatoms in the formula is 0.4+0.6=1, and the atomic fractions of Al and Oin the formula are 0.4 and 0.6, respectively. Atomic fractiondescriptions are described in many general textbooks and atomic fractiondescriptions are often used to describe alloys. (See, e.g.: (i) CharlesKittel, “Introduction to Solid State Physics,” seventh edition, JohnWiley & Sons, Inc., NY, 1996, pp. 611-627; (ii) Smart and Moore, “SolidState Chemistry, An Introduction,” Chapman & Hall University andProfessional Division, London, 1992, pp. 136-151; and (iii) James F.Shackelford, “Introduction to Materials Science for Engineers,” SixthEdition, Pearson Prentice Hall, New Jersey, 2005, pp. 404-418.)

Again referring to the “AlO_(x)N_(y),” “SiO_(x)N_(y),” and“Si_(u)Al_(x)O_(y)N_(z)” materials in the disclosure, the subscriptsallow those with ordinary skill in the art to reference these materialsas a class of materials without specifying particular subscript values.That is, to speak generally about an alloy, such as aluminum oxide,without specifying the particular subscript values, we can speak ofAl_(v)O_(x). The description Al_(v)O_(x) can represent either Al₂O₃ orAl_(0.4)O_(0.6). If v+x were chosen to sum to 1 (i.e. v+x=1), then theformula would be an atomic fraction description. Similarly, morecomplicated mixtures can be described, such as Si_(u)Al_(v)O_(x)N_(y),where again, if the sum u+v+x+y were equal to 1, we would have theatomic fractions description case.

Once again referring to the “AlO_(x)N_(y),” “SiO_(x)N_(y),” and“Si_(u)Al_(x)O_(y)N,” materials in the disclosure, these notations allowthose with ordinary skill in the art to readily make comparisons tothese materials and others. That is, atomic fraction formulas aresometimes easier to use in comparisons. For instance; an example alloyconsisting of (Al₂O₃)_(0.3)(AlN)_(0.7) is closely equivalent to theformula descriptions Al_(0.448)O_(0.31)N_(0.241) and also Al₃₆₇O₂₅₄N₁₉₈.Another example alloy consisting of (Al₂O₃)_(0.4)(AlN)_(0.6) is closelyequivalent to the formula descriptions Al_(0.438)O_(0.375)N_(0.188) andAl₃₇O₃₂N₁₆. The atomic fraction formulas Al_(0.448)O_(0.31)N_(0.241) andA10.43800.375N0.188 are relatively easy to compare to one another. Forinstance, Al decreased in atomic fraction by 0.01, O increased in atomicfraction by 0.065 and N decreased in atomic fraction by 0.053. It takesmore detailed calculation and consideration to compare the whole numberformula descriptions Al₃₆₇O₂₅₄N₁₉₈ and Al₃₇O₃₂N₁₆. Therefore, it issometimes preferable to use atomic fraction formula descriptions ofsolids. Nonetheless, the use of Al_(v)O_(x)N_(y) is general since itcaptures any alloy containing Al, O and N atoms.

As noted earlier, the protective film 90 of the article 100 depicted inFIG. 1 can include an inorganic material that is polycrystalline orsemi-polycrystalline. In some implementations of these protective films90, the inorganic material comprises a substantially isotropic,non-columnar microstructure. That is, the crystallites of the protectivefilm 90 are isotropic or near-isotropic in their shape and/ororientation with regard to one another. In some embodiments, asubstantially-isotropic microstructure can be obtained by a high powerimpulse magnetron sputtering (“HiPIMS”) process at depositiontemperatures of 600° C. and lower. HiPIMS process parameters include,but are not limited to, sputtering power, temperature, composition,chamber pressure, chamber process gases and substrate voltage bias toachieve a desirable combination of high hardness and toughness in theprotective film 90 having a substantially isotropic microstructure.

In some embodiments, the protective film 90 comprises aytrria-stabilized tetragonal zirconia polycrystalline (“Y-TZP”)material. Such films 90 deposited over a primary surface 12, 14 of asubstrate 10 are believed to be suitable for processing with a HiPIMSprocess. In some implementations, the Y-TZP material can comprise about1 to 8 mol % yttria and greater than 1 mol % of tetragonal zirconia. Itshould also be understood that the remainder of the film 90 can includeother phases of zirconia, including monoclinic and cubic, amorphouszirconia, and/or other materials such as alumina. Upon the applicationof stress to the protective film 90 having such compositions, thecrystal structure can change from tetragonal to monoclinic, whichresults in a volumetric expansion that can arrest the development ofcracks and/or mitigate the propagation of any pre-existing flaws andcracks. The net result is a protective film 90 with a high toughnessborne through a transformation-toughening mechanism. In other similarembodiments of these protective films 90, the tetragonal crystalstructure can be stabilized by ceria, at compositions understood bythose with ordinary skill to achieve the desired toughening withoutdetriment to hardness, along with optical properties.

According to some embodiments of the protective film 90, therelationship between the thickness 94 and its average crystallite sizecan be controlled to enhance the toughening of these films. Inparticular, the ratio of the thickness 94 of the film 90 to the averagecrystallite size can be 4× or greater, 5× or greater, 10× or greater,20× or greater, or even 50× or greater, but less than about 10,000×. Aprotective film 90 having a thickness 94 of 2 microns, for example,could be characterized by an average crystallite size of 500 nm or less,200 nm or less, 100 nm or less, or even 50 nm or less, but greater than1 nm. In other embodiments, the protective film 90 can have a greaterthickness 94, such as 5 microns thick or 10 microns thick or 20 micronsthick or 50 microns thick films, or thinner protective films 90, such asa thickness 94 of 1 micron or 0.5 microns.

In other implementations of the article 100 depicted in FIG. 1, theprotective film 90 can include one or more energy-absorbing compositionswith numerous microstructural defects (e.g., as defects intentionallydeveloped within the film or stemming from the microstructure of thefilm). In some embodiments, the energy-absorbing material can beselected from the group consisting of yttrium disilicate, boronsuboxide, titanium silicon carbide, quartz, feldspar, amphibole, kyaniteand pyroxene. The microstructural defects can facilitate plasticdeformation of the film 90 upon the application of stress. In someembodiments, the microstructure defects include but are not limited toshear bands, kink bands, dislocations, and other micro- and nano-scaledefects. For example, shear bands can be formed by plastic deformationalong a crystallographic slip system to result in a twinned region, andcan be observed in ceramics such as yttrium disilicate, and cermets suchas boron suboxide and titanium silicon carbide. Kink bands can be formedwhen plastic deformation does not occur along crystallographic planesand are common in metamorphic rock materials, e.g., quartz, feldspar,amphibole, kyanite and pyroxenes.

The source materials of the protective film 90 may be deposited as asingle layer film or a multilayer film, coating or structure. Moregenerally, the protective film 90, whether in a single film or amultilayer structure, can be characterized by a selected thickness,i.e., thickness 94 (see FIG. 1). In some embodiments, the thickness 94of a single layer or multilayer protective film 90 may be greater thanor equal to 50 nm, 75 nm, 100 nm, 125 nm, 150 nm, 175 nm, 200 nm, oreven greater lower thickness limits. In some embodiments, the thickness94 of the single layer or multilayer protective film 90 may be less thanor equal to 50,000 nm, 20,000 nm, 10,000 nm, 9,000 nm, 8,000 nm, 7,000nm, 6,000 nm, 5,000 nm, 4,000 nm, 3,000 nm, 2000 nm, 1500 nm, 1000 nm,500 nm, 250 nm, 150 nm or 100 nm. In further embodiments, the thickness94 of the single layer or multilayer protective film 90 may be betweenabout 200 nm and 50,000 nm, between about 200 nm and 20,000 nm, betweenabout 200 nm and about 10,000 nm, between about 200 nm and about 5,000nm, between about 200 nm and 2,000 nm, and all thickness values betweenthese thicknesses. As understood by those with ordinary skill in thefield of the disclosure, the thickness of the protective film 90 asreported herein was contemplated as being measured by scanning electronmicroscope (SEM) of a cross-section, by optical ellipsometry (e.g., byan n & k analyzer), or by thin film reflectometry. For multiple layerelements (e.g., a stack of layers), thickness measurements by SEM arepreferred.

The protective film 90, as present in the article 100, can be depositedusing a variety of methods including physical vapor deposition (“PVD”),electron beam deposition (“e-beam” or “EB”), ion-assisted deposition-EB(“IAD-EB”), laser ablation, vacuum arc deposition, thermal evaporation,sputtering, plasma enhanced chemical vapor deposition (PECVD) and othersimilar deposition techniques.

According to some embodiments, the article 100 depicted in FIG. 1employs a protective film 90 with an average hardness of 10 GPa or more.In some embodiments, the average hardness of these films can be about 10GPa or more, 11 GPa, or more, 12 GPa or more, 13 GPa or more, 14 GPa ormore, 15 GPa or more, 16 GPa or more, 17 GPa or more, 18 GPa or more, 19GPa or more, and all average hardness values between these values. Asused herein, the “average hardness value” is reported as an average of aset of measurements on the outer surface 92 b of the protective film 90using a nanoindentation apparatus. More particularly, hardness of thinfilm coatings as reported herein was determined using widely acceptednanoindentation practices. (See Fischer-Cripps, A. C., Critical Reviewof Analysis and Interpretation of Nanoindentation Test Data, Surface &Coatings Technology, 200, 4153-4165 (2006) (hereinafter“Fischer-Cripps”); and Hay, J., Agee, P., and Herbert, E., ContinuousStiffness measurement During Instrumented Indentation Testing,Experimental Techniques, 34 (3) 86-94 (2010) (hereinafter “Hay”).) Forcoatings, it is typical to measure hardness as a function of indentationdepth. So long as the coating is of sufficient thickness, it is thenpossible to isolate the properties of the coating from the resultingresponse profiles. It should be recognized that if the coatings are toothin (for example, less than ˜500 nm), it may not be possible tocompletely isolate the coating properties as they can be influenced fromthe proximity of the substrate which may have different mechanicalproperties. (See Hay.) The methods used to report the properties hereinare representative of the coatings themselves. The process is to measurehardness and modulus versus indentation depth out to depths approaching1000 nm. In the case of hard coatings on a softer glass, the responsecurves will reveal maximum levels of hardness and modulus at relativelysmall indentation depths (less than or equal to about 200 nm). At deeperindentation depths, both hardness and modulus will gradually diminish asthe response is influenced by the softer glass substrate. In this case,the coating hardness and modulus are taken be those associated with theregions exhibiting the maximum hardness and modulus. At deeperindentation depths, the hardness and modulus will gradually increase dueto the influence of the harder glass. These profiles of hardness andmodulus versus depth can be obtained using either the traditional Oliverand Pharr approach (as described in Fischer-Cripps), or by the moreefficient continuous stiffness approach (see Hay). The elastic modulusand hardness values reported herein for such thin films were measuredusing known diamond nanoindentation methods, as described above, with aBerkovich diamond indenter tip.

In some embodiments of the article 100 depicted in FIG. 1, theprotective film 90 is characterized by a compressive film stress ofgreater than 50 MPa, greater than 75 MPa, greater than 100 MPa, greaterthan 125 MPa, greater than 150 MPa, and allow lower limits of thecompressive film stress between these values. In some embodiments, thecompressive film stress of the protective film 90 can range from about50 MPa to about 400 MPa, from about 50 MPa to about 200 MPa, or fromabout 75 MPa to about 175 MPa. In some embodiments, the CS is 2000 MPaor less.

In some embodiments of the article 100 depicted in FIG. 1, theprotective film 90 is characterized by a fracture toughness of greaterthan about 1 MPa·m^(1/2), greater than about 2 MPa·m^(1/2), greater thanabout 3 MPa·m^(1/2), greater than about 4 MPa·m^(1/2), or even greaterthan about 5 MPa·m^(1/2). Fracture toughness of thin films is measuredas described in D. S Harding, W. C. Oliver, and G. M. Pharr, “CrackingDuring Nanoindentation and its Use in the Measurement of FractureToughness,” Mat. Res. Soc. Symp. Proc., vol. 356, 1995, 663-668. Thetoughness of the protective film 90 can also be manifested in highstrain-to-failure values, in some implementations. For example, theprotective film 90 can be characterized by strain-to-failure of greaterthan 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%,1.9%, or 2.0%, but no greater than 10%, all as measured by aring-on-ring test.

As used herein, a “ring-on-ring” test uses the following procedure formeasuring load-to-failure, failure strength, and strain-to-failurevalues. An article (e.g., the article 100) is positioned between thebottom ring and the top ring of a ring-on-ring mechanical testingdevice. The top ring and the bottom ring have different diameters. Asused herein, the top ring has a diameter of 12.7 mm and the bottom ringhas a diameter of 25.4 mm. The portion of the top ring and bottom ringwhich contact the article 100 and protective film 90 are circular incross section and each have a radius of 1.6 mm. The top ring and bottomring are made of steel. Testing is performed in an environment of about22° C. with 45%-55% relative humidity. The articles used for testing are50 mm by 50 mm squares in size.

To determine the strain-to-failure of the article 100 and/or theprotective film 90, force is applied to the top ring in a downwarddirection and/or to the bottom ring in an upward direction, using aloading/cross-head speed of 1.2 mm/minute. The force on the top ringand/or the bottom ring is increased, causing strain in the article 100until catastrophic failure of one or both of the substrate 10 and thefilm 90. A light and camera are provided below the bottom ring to recordthe catastrophic failure during testing. An electronic controller, suchas a Dewetron acquisition system, is provided to coordinate the cameraimages with the applied load to determine the load when catastrophicdamage is observed by the camera. To determine the strain-to-failure,camera images and load signals are synchronized through the Dewetronsystem, so that the load at which the protective film 90 shows failurecan be determined. The load-to-failure of the article 100 can also berecorded using stress or strain gauges rather than this camera system,though the camera system is typically preferred for independentlymeasuring the failure levels of the film 90. Finite element analysis, asfound in Hu, G., et al., “Dynamic fracturing of strengthened glass underbiaxial tensile loading,” Journal of Non-Crystalline Solids, 2014.405(0): p. 153-158, is used to analyze the strain levels the sample isexperiencing at this load. The element size may be chosen to be fineenough to be representative of the stress concentration underneath theloading ring. The strain level is averaged over 30 nodal points or moreunderneath the loading ring. According to other implementations, thearticle 100 may have a Weibull characteristic load-to-failure greaterthan about 200 kgf, greater than 250 kgf, or even greater than 300 kgf,for a 0.7 mm thick article 100 measured in a ring-on-ring testingprocedure. In these ring-on-ring tests, the side of the substrate 10with the protective film 90 is placed in tension and, typically, this isthe side that fails.

In addition to average load, stress (strength), and strain-to-failure, aWeibull characteristic load, stress, or strain-to-failure may becalculated. The Weibull characteristic load to failure (also called theWeibull scale parameter) is the load level at which a brittle material'sfailure probability is 63.2%, calculated using known statisticalmethods. Using these load-to-failure values, sample geometry, andnumerical analysis of the ring-on-ring test setup and geometry describedabove, a Weibull characteristic strain-to-failure value can becalculated for the article 100 of greater than 0.8%, greater than 1%, oreven greater than 1.2% and/or a Weibull characteristic strength (stressat failure) value greater than 600 MPa, 800 MPa, or 1000 MPa. Asrecognized by those with ordinary skill in the field of the disclosure,strain-to-failure and Weibull characteristic strength values, ascompared to failure load values, can apply more broadly to differentvariations of the article 100, e.g., as varied with regard to substratethickness, shape, and/or different loading or testing geometries.Without being bound by theory, the articles 100 may further comprise aWeibull modulus (i.e., a Weibull ‘shape factor’, or slope of a Weibullplot for samples loaded up to failure, using failure load, failurestrain, failure stress, or more than one of these metrics) of greaterthan about 3.0, greater than 4.0, greater than 5.0, greater than 8.0, oreven greater than 10, all as measured by a ring-on-ring flexural test.Finite element analysis as described above is used to analyze the strainlevels the article 100 is experiencing at the failure load, and thefailure strain levels can then be translated to failure stress (i.e.,strength) values using the known relationship strain=stress×elasticmodulus.

As used herein, the terms “strain-to-failure” and “averagestrain-to-failure” refer to the strain at which cracks propagate withoutapplication of additional load, typically leading to optically visiblefailure in a given material, layer or film and, perhaps even bridge toanother material, layer, or film, as defined herein. Strain-to-failurevalues may be measured using, for example, ring-on-ring testing.

According to some embodiments of the article 100 depicted in FIG. 1, theprotective film 90 is transparent or substantially transparent. In somepreferred embodiments, the protective film 90 is characterized by anoptical transmittance within the visible spectrum of greater than 50%,greater than 60%, greater than 70%, greater than 80%, greater than 90%,and all values between these lower limit transmittance levels. In otherimplementations, the protective film can be characterized by an opticaltransmittance in the visible spectrum of greater than 20%, greater than30%, greater than 40%, greater than 50%, greater than 60%, greater than70%, greater than 80%, greater than 90%, and all values between theselower limit transmittance levels.

In embodiments, the article 100 depicted in FIG. 1 can comprise a hazethrough the protective film 90 and the glass, glass-ceramic or ceramicsubstrate 10 of less than or equal to about 5 percent. In certainaspects, the haze is equal to or less than 5 percent, 4.5 percent, 4percent, 3.5 percent, 3 percent, 2.5 percent, 2 percent, 1.5 percent, 1percent, 0.75 percent, 0.5 percent, or 0.25 percent (including alllevels of haze between these levels) through the protective film 90 andthe substrate 10. The measured haze may be as low as zero. As usedherein, the “haze” attributes and measurements reported in thedisclosure are as measured on, or otherwise based on measurements from,a BYK-Gardner haze meter.

In some embodiments of the article 100 depicted in FIG. 1, theprotective film 90 can comprise a durable and scratch resistant opticalcoating (not shown) having controlled optical properties, includingreflectance, transmittance, and color. In these configurations, theoptical coating of the protective film 90 can comprise a multilayerinterference stack, the multilayer interference stack having an outersurface opposite the primary surface 12 of the substrate 10. Thesearticles 100 can exhibit a single side average photopic lightreflectance (i.e., as measured at the outer surface at near normalincidence) of about 10% or less over an optical wavelength regime in therange from about 400 nm to about 700 nm. The single sided reflectancemay be 9% or less, 8% or less, 7% or less, 6% or less, 5% or less, 4% orless, 3% or less, or 2% or less. The single sided reflectance may be aslow as 0.1%. These articles 100 may also exhibit reflectance colorcoordinates in the (L*, a*, b*) colorimetry system for all incidenceangles from 0 to 10 degrees, 0 to 20 degrees, 0 to 30 degrees, 0 to 60degrees, or 0 to 90 degrees under an International Commission onIllumination illuminant that are indicative of a reference point colorshift of less than about 12 from a reference point as measured at theouter surface of the optical coating of the protective film 90. As usedherein, the “reference point” includes at least one of the colorcoordinates (a*=0, b*=0) and the reflectance color coordinates of thesubstrate 10. When the reference point is defined as the colorcoordinates (a*=0, b*=0), the color shift is defined by√(a*_(article))²±(b*_(article))²). When the reference point is definedby the color coordinates of the substrate 10, the color shift is definedby √((a*_(article)−rt_(substrate))²+(b*_(article)−rt_(substrate))²).Accordingly, the color shift of the foregoing articles 100 from areference point can be less than about 12, less than about 10, less thanabout 8, less than about 6, less than about 4, or less than about 2.

The articles 100 disclosed herein may be incorporated into a devicearticle such as a device article with a display (or display devicearticles) (e.g., consumer electronics, including mobile phones, tablets,computers, navigation systems, wearable devices (e.g., watches) and thelike), augmented-reality displays, heads-up displays, glasses-baseddisplays, architectural device articles, transportation device articles(e.g., automotive, trains, aircraft, sea craft, etc.), appliance devicearticles, or any device article that benefits from some transparency,scratch-resistance, abrasion resistance or a combination thereof. Anexemplary device article incorporating any of the articles disclosedherein (e.g., as consistent with the articles 100 depicted in FIG. 1) isshown in FIGS. 2A and 2B. Specifically, FIGS. 2A and 2B show a consumerelectronic device 200 including a housing 202 having front 204, back206, and side surfaces 208; electrical components (not shown) that areat least partially inside or entirely within the housing and includingat least a controller, a memory, and a display 210 at or adjacent to thefront surface of the housing; and a cover substrate 212 at or over thefront surface of the housing such that it is over the display. In someembodiments, the cover substrate 212 may include any of the articlesdisclosed herein. In some embodiments, at least one of a portion of thehousing or the cover glass comprises the articles disclosed herein.

According to some embodiments, the articles 100 may be incorporatedwithin a vehicle interior with vehicular interior systems, as depictedin FIG. 3. More particularly, the article 100 (see FIG. 1) may be usedin conjunction with a variety of vehicle interior systems. A vehicleinterior 340 is depicted that includes three different examples of avehicle interior system 344, 348, 352. Vehicle interior system 344includes a center console base 356 with a surface 360 including adisplay 364. Vehicle interior system 348 includes a dashboard base 368with a surface 372 including a display 376. The dashboard base 368typically includes an instrument panel 380 which may also include adisplay. Vehicle interior system 352 includes a dashboard steering wheelbase 384 with a surface 388 and a display 392. In one or more examples,the vehicle interior system may include a base that is an armrest, apillar, a seat back, a floor board, a headrest, a door panel, or anyportion of the interior of a vehicle that includes a surface. It will beunderstood that, the article 100 described herein can be usedinterchangeably in each of vehicle interior systems 344, 348 and 352.

According to some embodiments, the articles 100 may be used in a passiveoptical element, such as a lens, windows, lighting covers, eyeglasses,or sunglasses, that may or may not be integrated with an electronicdisplay or electrically active device.

Referring again to FIG. 3, the displays 364, 376 and 392 may eachinclude a housing having front, back, and side surfaces. At least oneelectrical component is at least partially within the housing. A displayelement is at or adjacent to the front surface of the housings. Thearticle 100 (see FIG. 1) is disposed over the display elements. It willbe understood that the article 100 may also be used on, or inconjunction with the armrest, the pillar, the seat back, the floorboard, the headrest, the door panel, or any portion of the interior of avehicle that includes a surface as explained above. According to variousexamples, the displays 364, 376 and 392 may be a vehicle visual displaysystem or vehicle infotainment system. It will be understood that thearticle 100 may be incorporated in a variety of displays and structuralcomponents of autonomous vehicles and that the description providedherein with relation to conventional vehicles is not limiting.

Example 1

As described herein, reactive sputtering may be used to fabricateZrO₂-based films having a predetermined combination of hardness,effective toughness, refractive index, optical absorption (i.e.,extinction coefficient), and film stress for use as components ofmultilayer optical films, including anti-reflective multilayer films andother types of interference films (e.g. dielectric mirror films, IRblocking films, UV blocking films, wavelength-selective bandpass ornotch filters) with high mechanical durability.

As used herein, “ZrO₂-based” films may comprise greater than 80% ZrO₂ bymolarity or by volume. Moreover, ZrO₂-based films may also optionallyinclude partially stabilized or stabilized zirconia. Finally, ZrO₂-basedfilms may also include additives or dopants such as Al₂O₃, Y₂O₃, and thelike, or stabilizing agents such as Ce, La, Sr, Mn, Ca, and the like.

In other words, coatings combining high hardness and high toughness mayhave greater resistance to multiple different modes of scratch,abrasion, frictive, impact, and contact damage than coatings having highhardness alone. In addition, coatings with higher toughness can toleratehigher strain, thereby allowing greater flexure, for example, when usedon flexible substrates.

In some examples, the coating described herein may be formed on atransparent substrate (e.g., sapphire, polymer, glass, orchemically-strengthened glass such as chemically-strengthenedaluminosilicate glass or Gorilla Glass®). In some examples, theZrO₂-based films may be coated on glass substrates, thin glasssubstrates, flexible glass substrates, or chemically-strengthened glasssubstrates to form optically coated durable articles. The transparentsubstrate may have a thickness of less than 2 mm, or less than 1 mm, orless than 0.7 mm, or less than 0.5 mm, or less than 0.3 mm, or less than0.25 mm, or less than 0.1 mm.

Table 1 describes properties of ZrO₂ and comparative films.

Extinction Nano- Effective Coating Coating Coating Refractivecoefficient Film indentation Elastic toughness crack onset failurethickness index (n) (k) at Stress hardness (H) modulus (E) (Kc) strainstress Material (μm) at 550 nm 400 nm (Mpa) (Gpa) (Gpa) (Mpa√m) (%)(MPa) Comparative Chemically- none 1.51 8.2 71 1.43 strengthenedaluminosilicate glass SiO2 2.1 1.47 7.6 0.92 Al2O3 1.9 1.65 11.3 2.71SiOxNy 2.1 1.9 16.8 2.06 AlOxNy 1.5 1.95 19.9 180 1.44 Si3N4 1.8 2.019.5 1.94 ZrO2:Y2O3 2.2 1.86 1.1 × 10−1  6 11.7 150 2.02 ± 0.19 (97:3)Examples ZrO₂ 1.12 2.21 8 × 10⁻⁴ −470 13.2 180 3.78 ± 0.08 3.7 2.2 9 ×10⁻⁴ −280 4.31 ± 0.37 2.24 2.2 1 × 10⁻³ −110 13.2 190 3.02 ± 0.2  2.242.2 8 × 10⁻⁴ −330 13.2 180 4.84 ± 0.16 1.75 2.2 3 × 10⁻⁴ −120 13.9 1903.23 ± 0.27 2.2 2.2 2 × 10⁻⁴ −90 13.9 190 3.2 ± 0.3 0.72 1230

Thus, as described above, a hard-coating or a hard-coated glass articlecomprising: a nanoindentation hardness of greater than 10 GPa, orgreater than 11 GPa, or greater than 12 GPa, or greater than 13 GPa. Insome examples, the hard-coating or a hard-coated glass article comprisesan effective fracture toughness (Kc) (measured by indentation fracture)of greater than 2.5, or greater than 3.0, or greater than 3.5, orgreater than 4.0. In some examples, the hard-coating or a hard-coatedglass article comprises a coating film stress less than (i.e., morenegative than, or more highly compressive than) −50 MPa compressivestress, such as in a range of −50 MPa to −1000 MPa, or in a range of −75MPa to −500 MPa, or in a range of −100 MPa to −400 MPa. In someexamples, the hard-coating or a hard-coated glass article comprises aphotopic average optical transmission in the visible range of greaterthan 50%, or of greater than 60%, or of greater than 70%, or of greaterthan 75%.

In some examples, the hard-coating or a hard-coated glass articlecomprises a refractive index measured at 550 nm wavelength of greaterthan 1.8, or greater than 1.9, or greater than 2.0, or greater than 2.1,or greater than 2.15. In some examples, the hard-coating or ahard-coated glass article comprises an optical extinction coefficient(k) measured at 400 nm wavelength of less than 0.1, or less than 0.01,or less than 5×10′, or less than 1×10′, or less than 5×10⁻⁴.

In some examples, the hard-coating or a hard-coated glass articlecomprises a coating thickness in a range of 0.5 μm to 50 μm; or in arange of 0.5 μm to 20 μm; or in a range of 0.5 μm to 10 μm; or in arange of 1.0 μm to 5.0 μm; or in a range of 1.1 μm to 3.75 μm; or in arange of 1.5 μm to 2.5 μm. In some examples, the hard-coating or ahard-coated glass article comprises a coating strain to failure ofgreater than 0.5%, or of greater than 0.6%, or of greater than 0.7% forcoatings having thicknesses greater than 1 μm, or greater than 2 μm, orgreater than 3 μm. In some examples, the hard-coating or a hard-coatedglass article comprises a coating failure stress of greater than 800MPa, or of greater than 1000 MPa, or of greater than 1200 MPa for thesame coating. In some examples, the hard-coating or a hard-coated glassarticle comprises a composition having greater than 80% ZrO₂, or greaterthan 90% ZrO₂, or greater than 95% ZrO₂, or greater than 98% ZrO₂, orgreater than 99% ZrO₂ by molar concentration or volume. In someexamples, the hard-coating or a hard-coated glass article comprisestetragonal ZrO₂, monoclinic ZrO₂, or a combination thereof. In someexamples, the hard-coating or a hard-coated glass article comprises aphotopic average optical absorption (measured as100%-Reflectance-Transmittance), of less than 10%, or of less than 5%,or of less than 3%, or of less than 2%, or of less than 1%.

In some examples, the hard-coating or hard-coated glass articles maycomprise multilayer optical coatings, such as those employing opticalinterference (e.g., anti-reflective coatings, dielectric mirror films,IR blocking films, UV blocking films, wavelength-selective bandpass,notch filters, and the like). These multilayer optical coatings may havehigh mechanical durability owing to the high hardness and high effectivetoughness of ZrO₂-based films described herein. In these multilayerfilms, high refractive index ZrO₂ may be combined with at least onelayer of lower refractive index material (e.g., SiO₂, Al₂O₃, etc.) toachieve desired optical interference effects.

In examples where the glass articles use chemically- orthermally-strengthened glass substrates, the coated glass article mayhave a surface compressive stress of at least 200 MPa, or at least 400MPa, or at least 600 MPa, or at least 800 MPa. High levels ofcompressive stress typically require the glass to not be processed afterstrengthening for prolonged time periods at temperatures approaching thestrain point of the glass. In other words, ZrO₂ film depositiontemperatures (e.g., less than 350° C., or less than 100° C., including300 C substrate temperature and nominally room temperature substratetemperatures during film depositions used in Examples) are significantto the realization of optimal strengthened glass products having thebenefits of hard, tough coatings.

In some examples, the zirconia-based coatings described herein may bedeposited by at least one of (1) RF sputtering from a sputtering targetcomprising Zr or ZrO₂; (2) high power impulse magnetron sputtering(HiPIMS) using a pulse on/off ratio of 10-30 μ-sec ‘on’ to 60-100 μ-sec‘off’; (3) sputtering with oxygen gas at a partial pressure of 0.1 mTorrto 1.0 mTorr; and (4) substrate temperatures during deposition of lessthan 350° C., or less than 310° C., or less than 200° C., or less than100° C., or less than 60° C.

Hardness was measured by known nano-indentation techniques; effectivetoughness was measured and calculated using the Lawn-Evans-Marshallmodel. Toughness values reported are selected from higher depths (e.g.,greater than about 1 μm) to ensure a half-penny crack morphology. Theeffective toughness may depend on the deposited film stress. Forexample, higher compressive stresses may result in higher measuredeffective toughness; however, the controlled ranges of compressivestress applied herein are preferred in order to reduce sample warpage.In other words, film stress is kept within the disclosed ranges sinceoverly high film stress leads to product warpage, particularly forthinner substrates. Thus, compressive stress cannot be arbitrarilyincreased to create a high effective toughness without creating othernegative artifacts of high compressive stress. Crack onset strain andcoating failure stress were measured in flexure using a ring-on-ringtest setup, as described herein.

Many variations and modifications may be made to the above-describedembodiments of the disclosure without departing substantially from thespirit and various principles of the disclosure. All such modificationsand variations are intended to be included herein within the scope ofthis disclosure and protected by the following claims.

What is claimed is:
 1. An article, comprising: a transparent substratecomprising a primary surface; and a protective film disposed on theprimary surface, wherein the protective film comprises at least one of:(1) a hardness of greater than 13 GPa, as measured by a Berkovichnanoindenter, (2) an effective fracture toughness (Kc) of greater than2.5 MPa·m^(1/2), or (3) an optical extinction coefficient (k) equal toor less than 1×10⁻², measured at 400 nm wavelength.
 2. The articleaccording to claim 1, wherein the protective film comprises astrain-to-failure of greater than 0.7%, as measured by a ring-on-ringtest.
 3. The article according to claim 1, wherein the protective filmcomprises a thickness in a range of 1.0 μm to 50 μm.
 4. The articleaccording to claim 1, wherein the protective film comprises both (1) and(2).
 5. The article according to claim 1, wherein the protective filmcomprises a compressive film stress greater than 50 MPa.
 6. The articleaccording to claim 1, wherein the protective film comprises an opticaltransmittance of 50% or more in the visible spectrum.
 7. The articleaccording to claim 1, wherein the protective film comprises a refractiveindex (n) of at least 2.0, measured at 550 nm wavelength.
 8. The articleaccording to claim 1, wherein each of the substrate and the protectivefilm comprises an optical transmittance of 20% or more in the visiblespectrum.
 9. The article according to claim 1, wherein the protectivefilm comprises a coating failure stress of greater than 800 MPa.
 10. Thearticle according to claim 1, wherein the protective film comprises acomposition having greater than 80% ZrO₂, by molar concentration orvolume.
 11. The article according to claim 10, wherein the protectivefilm comprises tetragonal ZrO₂, monoclinic ZrO₂, or a combinationthereof.
 12. The article according to claim 1, wherein the protectivefilm comprises an inorganic material, wherein the material ispolycrystalline or semi-polycrystalline and comprises an averagecrystallite size of less than 1 micron.
 13. The article according toclaim 1, wherein the substrate further comprises a compressive stressregion, the compressive stress region extending from the primary surfaceto a first selected depth in the substrate.
 14. The article according toclaim 1, wherein the protective film comprises a multilayer opticalcoating selected from at least one of: anti-reflective film, dielectricmirror film, infrared blocking film, ultraviolet blocking film,wavelength-selective bandpass film, or notch filter.
 15. The articleaccording to claim 14, wherein the multilayer optical coating comprisesat least one ZrO₂-based film having a refractive index of n1, and atleast one lower refractive index material film having a refractive indexof n2, wherein n1 is greater than n2.
 16. A consumer electronic product,comprising: a housing comprising front, back and side surfaces;electrical components that are at least partially inside the housing;and a display at or adjacent to the front surface of the housing,wherein the article of claim 1 is at least one of disposed over thedisplay and disposed as a portion of the housing.
 17. A vehicle displaysystem, comprising: a housing comprising front, back and side surfaces;electrical components that are at least partially inside the housing;and a display at or adjacent to the front surface of the housing,wherein the article of claim 1 is at least one of disposed over thedisplay and disposed as a portion of the housing.
 18. A devicecomprising the article of claim
 1. 19. The device of claim 18,comprising a camera lens cover, an optical sensor cover, or an infrared(IR) sensor cover.
 20. An article, comprising: a transparent substratecomprising a primary surface; and a protective film disposed on theprimary surface, wherein the protective film comprises: (1) a hardnessof greater than 13 GPa, as measured by a Berkovich nanoindenter, (2) aneffective fracture toughness (Kc) of greater than 2.5 MPa·m^(1/2), and(3) an optical extinction coefficient (k) equal to or less than 1×10⁻²,measured at 400 nm wavelength; wherein the protective film comprises astrain-to-failure of greater than 0.7%, as measured by a ring-on-ringtest; wherein the protective film comprises a thickness in a range of1.0 μm to 50 μm; wherein the protective film comprises a compressivefilm stress greater than 50 MPa; wherein the protective film comprisesan optical transmittance of 50% or more in the visible spectrum; whereinthe protective film comprises a refractive index (n) of at least 2.0,measured at 550 nm wavelength; wherein each of the substrate and theprotective film comprises an optical transmittance of 20% or more in thevisible spectrum; and, wherein the protective film comprises a coatingfailure stress of greater than 800 MPa.
 21. A consumer electronicproduct, comprising: a housing comprising front, back and side surfaces;electrical components that are at least partially inside the housing;and a display at or adjacent to the front surface of the housing,wherein the article of claim 20 is at least one of disposed over thedisplay and disposed as a portion of the housing.